Light emitting diode package and light emitting module comprising the same

摘要

The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.

主权项

1. A light emitting diode package, comprising:
a light emitting diode chip; a lead frame comprising a chip area on which the light emitting diode chip is disposed; and a package body comprising a cavity and supporting the lead frame, wherein: the chip area is exposed through the cavity; the lead frame comprises a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area; the first terminal group and the second terminal group each comprise a first terminal connected to the chip area and a second terminal separated from the chip area; the second terminal of the first terminal group is exposed through the cavity; and the second terminal of the second terminal group is buried in the package body and not exposed through the cavity.