| 摘要 |
The present invention relates to an antenna substrate and a method for manufacturing the same. The method for manufacturing the antenna substrate includes the steps of: forming a first wiring layer and a second wiring layer, which are patterned to cover a portion on which a via hole will be formed, by printing predetermined patterns on both sides with a conductive paste composition including one selected from conductive Ag paste, conductive Cu paste, conductive Sn paste, graphene, a conductive polymer, and gravure paste, or a mixture thereof; forming the via hole; electrically connecting a wiring layer, formed on one side of the antenna substrate, to a wiring layer, formed on the other side of the antenna substrate as the wiring layer is connected to a via formed in the via hole by providing conductivity to the via hole by forming the via in the via hole; forming additionally electroless metal plating layers to increase electrical conductivity of the patterned wiring layers formed on both sides of the antenna substrate; forming a protection layer formed to cover the whole surface, except a terminal portion, of an upper portion including electroless metal plating layers of the first wiring layer and the second wiring layer; and forming an SMT and metal plating layers for preventing oxidation on the electroless metal plating layer on the terminal portion. |
