| 摘要 |
The present invention relates to a light emitting diode (LED) package which can be coated with a fluorescent body in a wafer state under various conditions, and manufactured in a wafer unit to simplify a manufacturing process and improve productivity. The LED package according to the present invention comprises: a growth substrate; an epitaxial layer formed on the growth substrate; a first and a second electrode layer; an insulation layer; an electrode pad layer electrically connected to the first and the second electrode layer; a cutting groove formed by partially cutting between LED chips to surround the LED chips; a resin dam layer formed by filling the cutting groove to surround the LED chips; and a fluorescent body layer formed on the LED chips while the resin dam layer prevents a fluorescent body from flowing toward an adjacent LED chip. |
