| 摘要 |
Provided are a method, an apparatus and a computer program for filling a liquid material, which do not require complicated parameter calculation and which do not affect the moving speed of a discharge unit. In the method for filling a gap between a substrate and a work placed thereon with the liquid material discharged from the discharge unit by utilizing a capillary action, the method is characterized in forming an application pattern made up of an application region and a non-application region along an outer periphery of the work, and correcting a discharge amount of the liquid material by extending and contracting the application region and the non-application region. The apparatus and the program for carrying out the method are also provided. |
