Provided is a wire bonding device. The wire bonding device comprises: a loading unit for accommodating first semiconductor package structures; an unloading unit horizontally facing the loading unit; and a placing unit having heater blocks and fixing clamps which contact the first semiconductor package structures on routes of the semiconductor package structures wherein the placing unit is located between a loading unit and an unloading unit.
申请公布号
KR20150118792(A)
申请公布日期
2015.10.23
申请号
KR20140044864
申请日期
2014.04.15
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, DOO JIN;KIM, YOUNG SIK;UM, TEA SEOG;HA, YONG DAE