| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 μm and not greater than 600 μm. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device. |
| 申请公布号 |
US2015303166(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201514642667 |
申请日期 |
2015.03.09 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
MOMOSE Fumihiko;SAITO Takashi;KIDO Kazumasa;NISHIMURA Yoshitaka |
| 分类号 |
H01L23/00;B23K20/10;B23K20/26;B23K20/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding, the apparatus comprising:
a wire feeding device which feeds the wire, the wire having a diameter not less than 500 μm and not greater than 600 μm; a heating device which heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C.; a pressure device which presses the wire against the electrode; and an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device. |
| 地址 |
Kawasaki-shi JP |
