| 发明名称 |
VARIABLE INTERCONNECT PITCH FOR IMPROVED PERFORMANCE |
| 摘要 |
A method of designing conductive interconnects includes determining a residual spacing value based at least in part on an integer multiple of a interconnect trace pitch and a designated cell height. The method also includes allocating the residual spacing to at least one interconnect trace width or interconnect trace space within the interconnect trace pitch. |
| 申请公布号 |
US2015301973(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414484137 |
申请日期 |
2014.09.11 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
RIM Kern;SONG Stanley Seungchul;CHEN Xiangdong;Stephany Raymond George;ZHU John Jianhong;KWON Ohsang;TERZIOGLU Esin;YEAP Choh Fei |
| 分类号 |
G06F13/40;G06F13/42 |
主分类号 |
G06F13/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of arranging a plurality of conductive interconnects within an interconnect cell size, comprising:
determining a residual spacing value based at least in part on an integer multiple of an interconnect trace pitch and the interconnect cell size; and allocating the residual spacing value to at least one interconnect trace width or interconnect trace space of at least a predetermined one of the plurality of conductive interconnects within the interconnect cell size. |
| 地址 |
San Diego CA US |
