发明名称 FOAMABLE COMPOSITION WITH LOW HEAT CONDUCTIVITY FOR USE IN PROFILED PLASTIC PARTS
摘要 A foamable composition is described that includes at least one base polymer, at least one propellant, at least one lubricant and/or at least one heat stabilizer, and optionally additional additives, selected from crosslinking agents, heat reflectors, heat flow additives, anti-condensation additives, and/or fillers. Corresponding compositions can be processed into polymer foams which can have a heat conductivity of <0.04 E(mK), and an expansion greater than or equal to 1000%, and a weldability of 80 seconds at 240-260° C. Corresponding polymer foams can be advantageously introduced into hollow profiled plastic parts for windows and doors using a coextrusion process and can thus be used to produce door and window frames with low conductivity values.
申请公布号 US2015299411(A1) 申请公布日期 2015.10.22
申请号 US201314385066 申请日期 2013.03.12
申请人 SIKA TECHNOLOGY AG 发明人 ACKERMANN Herbert;HOEFFLIN Frank;BRUNNER Andreas
分类号 C08J9/10;C08J9/00 主分类号 C08J9/10
代理机构 代理人
主权项 1. A foamable composition comprising a) at least one base polymer; b) at least one propellant; and c) at least one lubricant and/or at least one heat stabilizer.
地址 Baar CH