| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method capable of excellently drying a substrate surface while suppressing or preventing pattern collapse and to provide a substrate processing apparatus.SOLUTION: An organic solvent replacing step (S9) for providing a top face of a substrate with a liquid IPA, forming an IPA liquid film covering the top face of the substrate on the substrate, and replacing a rinse liquid by the liquid IPA is performed. A substrate temperature increasing step (S10) is performed in which, after forming the IPA liquid film, a temperature of the top face of the substrate W is brought to a liquid film floating temperature, thus in a whole area of the IPA liquid film, an IPA evaporation gas film is formed between the IPA liquid film and the top face of the substrate, and the IPA liquid film is floated above the IPA evaporation gas film. An organic solvent removal step (S11) is performed in which the floating IPA liquid film is removed from the top face of the substrate. |
