ELECTRONIC COMPONENT BUILT-IN MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress disconnection or a short circuit in a conductor pattern by reducing voids between a film for forming a resist pattern to be used for patterning a wiring layer and a base layer of the wiring layer.SOLUTION: An electronic component built-in multilayer wiring board 10 includes: a substrate 20 on which a conductor layer 31 is formed; an opening 22 formed by removing a part of the conductor layer 21; a cavity 20a formed to penetrate the substrate 20 exposed by the opening 22; an electronic component 23a built in the cavity 20a; an insulating layer 24 stacked on the electronic component 23a and the substrate 20; and a wiring layer 31 formed on the insulating layer 24. A width S1 of the substrate 20 exposed between the cavity 20a at a first side 221 of the opening 22 and the conductor layer 21 is greater than a width S2 of the substrate exposed between the cavity 20a at a second side 222 of the opening 22 opposing the first side 221 and the conductor layer 21.