发明名称 VACUUM VAPOR DEPOSITION APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus having a shutter exchange mechanism applicable to a linear evaporation source without generating radiant heat to an object to be vapor-deposited and without adding a dedicated drive part for the exchange of a shutter plate to which a vapor deposition material adheres.SOLUTION: A vacuum vapor deposition apparatus of the present invention includes a linear evaporation source having a plurality of nozzles in the longitudinal direction, and a shutter mechanism that causes opening/closing movement of a shutter plate to block a vapor deposition material evaporating from the evaporation source. The shutter mechanism includes a shutter base that supports the shutter plate, a shutter drive part that causes linear opening/closing movement of the shutter base on a plane vertical to a direction of evaporation and supply, shutter plate holding means that holds a plurality of the shutter plates laminated on the evaporation source side of the shutter base, and shutter base separation means that sequentially separates the shutter plates from the evaporation source side by movement on extension of opening movement.</p>
申请公布号 JP2015183229(A) 申请公布日期 2015.10.22
申请号 JP20140060314 申请日期 2014.03.24
申请人 HITACHI HIGH-TECH FINE SYSTEMS CORP 发明人 AKIBA YUJI;MIYAKE TATSUYA;MATSUURA HIROYASU;MINEKAWA HIDEAKI
分类号 C23C14/24 主分类号 C23C14/24
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