DIE PACKAGE COMPRISING DIE-TO-WIRE CONNECTOR AND A WIRE-TO-DIE CONNECTOR CONFIGURED TO COUPLE TO A DIE PACKAGE

摘要

Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.

主权项

1. An integrated device package comprising:
a package substrate comprising a first surface, a second surface, and an exterior side surface; a die coupled to the first surface of the package substrate; an encapsulation layer at least partially encapsulating the die, the encapsulation layer comprising a first exterior surface; and a first plurality of metal layers coupled to the first exterior surface of the encapsulation layer and the exterior side surface of the package substrate.