| 发明名称 |
Die Bonding Device |
| 摘要 |
A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit. |
| 申请公布号 |
US2015303081(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201514660093 |
申请日期 |
2015.03.17 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Hwang Yisung;Lee Sugil;Kim Dongjun;Ha Yongdae |
| 分类号 |
H01L21/67;H01L21/687 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A die bonding device comprising;
a wafer holder supporting a wafer on which a die is formed; an ejector holder disposed at an inner portion of the wafer holder and below the wafer and supporting a die ejector configured to help separate the die from the wafer; a support unit supporting a substrate on which the separated die is to be attached; a bonding unit configured to pick up the separated die from the wafer and attach the picked-up die to the substrate; an ejector buffer unit configured to receive the die ejector; and a replacing unit configured to transfer the die ejector between the ejector holder and the ejector buffer unit. |
| 地址 |
Suwon-si KR |
