ETCHING APPARATUS, ETCHING METHOD, SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE

摘要

An etching apparatus (100) includes: an etching tank (110) having a substrate carry-in port (111) and a substrate carry-out port (112); a transfer apparatus (120) that transfers a substrate (500) from the substrate carry-in port (111) toward the substrate carry-out port (112); a nozzle (130), which is provided in the etching tank (110), and which sprays a reaction gas to a rear surface (510) of the substrate (500) transferred by means of the transfer apparatus (120); and an airflow control apparatus (140), which is provided in the etching tank (110), and which suppresses flowing of external air into a gap (131) between the rear surface (510) of the substrate (500) and the nozzle (130), said external air having been flowed into the etching tank (110) from the substrate carry-in port (111) and the substrate carry-out port (112).