| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device achieving high reliability.SOLUTION: A semiconductor device of an embodiment includes: a first semiconductor unit which includes a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, a wiring layer provided above the first semiconductor chips and electrically connecting the first semiconductor chips to each other, and a plurality of electrodes for circuit board connection, provided at an upper part of the wiring layer; and a second semiconductor unit which is fixed to a region sandwiched by the electrodes for circuit board connection on a side of the wiring layer in the first semiconductor unit, has a second semiconductor chip and is electrically connected to the first semiconductor unit. |
