| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which adhesiveness between a cap and a bump electrode is strong.SOLUTION: A semiconductor device of an embodiment comprises: a semiconductor chip; a cap which is arranged opposite to the semiconductor chip and has a through electrode arranged in a through hole; and a convex bump electrode which is installed between the semiconductor chip and the cap, for connecting the semiconductor chip and the through electrode. The bump electrode is at least partially included in the through electrode and electrically connected to the through electrode. |
