发明名称 SUBSTRATE PROCESSING APPARATUS, METHOD AND PROGRAM OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a deposition technique capable of adjusting the work function of a metal film for gate electrode.SOLUTION: A composite metal nitride film, such as a TiHfN film having crystallinity is deposited on a substrate, by supplying a first raw material gas containing a first metal element, such as TiCl, and a second raw material gas different from the first raw material gas and containing a second metal element, such as TDEAHf, and ethyl ligand, alternately and repeatedly to a substrate in the processing chamber. The work function can be modulated by controlling the deposition temperature. Thereafter, a TiN film is deposited thereon by supplying TiCl gas and ammonia gas alternately and repeatedly.
申请公布号 JP2015185825(A) 申请公布日期 2015.10.22
申请号 JP20140064064 申请日期 2014.03.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 HARADA KAZUHIRO;OGAWA ARITO
分类号 H01L21/285;C23C16/34;C23C16/455;H01L21/28;H01L29/423;H01L29/49 主分类号 H01L21/285
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