| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate that hardly generates warpage capable of increasing a signal transmission speed between electronic components and to provide a manufacturing method of the same.SOLUTION: An area of a first conductor layer 158Fa is 3% to 15% in reference to an area of a top face of an inner layer interlayer resin insulation layer 150Fa. When less than 3%, since a variation in a plating thickness becomes large, disconnection is easily generated at a place where a wiring becomes too thin and connection reliability may not be obtained. On the other hand, when exceeding 15%, warpage becomes easy to be generated. |
