| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring structure capable of suppressing decrease in the reliability of wiring.SOLUTION: A wiring structure includes a first insulating layer 109 formed on a first conductive layer, a first connection hole 119b formed in the first insulating layer and located above the first conductive layer, a second conductive layer 122 formed on the bottom surface and the inner side face of the first connection hole, a second insulating layer 123 buried on the inside of the second conductive layer in the first connection hole, and first wiring 126 formed on the second conductive layer and second insulating layer.</p> |
