| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide adhesive sheets excellent in foreign matter absorptivity and, when being used as the background sheets of grinding in a semiconductor wafer, capable of preventing the cracking of the semiconductor wafer.SOLUTION: Provided are adhesive sheets 1a to 1d comprising: a rigid base material 11 having a Young's modulus of 1,000 MPa or more; a buffer layer 12 provided at either side of the rigid base material 11; and an adhesive layer 13 provided on the other side of the rigid base material 11. The buffer layer 12 is a layer formed of a composition for forming the buffer layer 12 including an energy ray polymerizable compound, and also, when the tip of a triangular pyramid-shaped indenter with a tip curvature radius of 100 nm and a crest interval angle of 115° is pushed into the buffer layer 12 at a rate of 10μm per minute, the indentation depth (X) required for the arrival of the compressive load to 2 mN is 2.5μm or higher.</p> |
