| 发明名称 |
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD |
| 摘要 |
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less. |
| 申请公布号 |
US2015305167(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201314414453 |
申请日期 |
2013.06.25 |
| 申请人 |
HARIMA CHEMICALS, INCORPORATED |
发明人 |
NAKANISHI Kensuke;INOUE Kosuke;ICHIKAWA Kazuya;SHIGESADA Tetsuyuki;TAKEMOTO Tadashi |
| 分类号 |
H05K3/34;H05K1/09;C22C13/02;B23K35/26;B23K35/02 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A tin-silver-copper solder alloy consisting of:
tin, silver, copper, bismuth, nickel, and cobalt, wherein relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the copper content is 0.1 mass % or more and 1 mass % or less, the bismuth content is 0.5 mass % or more and 4.8 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, the cobalt content is 0.001 mass % or more and 0.008 mass % or less, and the tin content is the remaining content. |
| 地址 |
Kakogawa-shi, Hyogo JP |
