COMPOSITION FOR HIGH THERMAL CONDUCTIVE MATERIALS

摘要

A composition containing (A) resin, (B) a filler with thermally conductive, electrically insulative and (C) a filler with thermally conductive, electrically conductive, wherein the content of (C) is 0.2 to 2.0 volume% is disclosed. A molded article formed from the composition has unexpected high thermal conductivity with good electrical insulation as well as easy processability suitable for a thermal management component.