| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor inspection device in which a semiconductor wafer can be controlled to a constant temperature.SOLUTION: A head plate 5 is arranged above a wafer chuck 7, a card holder 3 is fixed onto a head stage 4 thereon, and a probe card 1 is attached to the card holder. The probe card 1 includes a needle 2 corresponding to the arrangement of electrode pads of an IC chip, and when it is brought into contact with an electrode pad formed on a semiconductor chip on the wafer, they are connected electrically to bring about a state where the electrical characteristics of the semiconductor chip can be inspected.</p> |
