| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board for power module excellent in heat dissipation performance, and a board for power module with heat sink.SOLUTION: In a board 10 for power module where a circuit layer 12 is provided on one side of a ceramic substrate 11, and a metal layer 13 composed of aluminum is brazed to the other side, the metal layer 13 is formed of an aluminum alloy having a thickness of 0.1 mm or more and less than 0.4 mm, containing 97 mass% or more and 99.95 mass% or less of Al, 0.1 mass% or more and 1.0 mass% or less of Fe, and 2.0 mass% or less of Mn, where the ratio Mn/Fe of Mn to Fe is in a range of 0.5 or more and 20 or less.</p> |
