SEMICONDUCTOR LASER MODULE AND SEMICONDUCTOR LASER MODULE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To achieve a high-output and highly reliable semiconductor laser module.SOLUTION: A semiconductor laser module 1 comprises: a laser mount 31 bonded to a top face of a substrate 10; a semiconductor laser chip 32 bonded to a top face of the laser mount 31; and a first electrode 52 connected to the top face of he laser mount 31 via a plurality of wires 54. The plurality of wires 54 are connected to both of a region 35a and a region 35b of the top face of the laser mount 31 and are not connected to a region sandwiched by the region 35a and the region 35b.