| 发明名称 |
CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE |
| 摘要 |
A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate. |
| 申请公布号 |
US2015305159(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201314440016 |
申请日期 |
2013.10.25 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
YAMAMOTO Hiroki;WATANABE Keishi;TAMAGAWA Hiroshi |
| 分类号 |
H05K1/18;H05K1/11;H05K1/16 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip capacitor comprising:
a substrate; a pair of external electrodes formed on the substrate; a capacitor element connected between the pair of external electrodes; and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. |
| 地址 |
Kyoto-shi, Kyoto JP |
