发明名称 ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC PARTS AND METHOD OF MANUFACTURING ELECTRONIC PARTS
摘要 <p>PROBLEM TO BE SOLVED: To suppress squeezing out of resin provided between electronic parts facing and electrically connected to each other.SOLUTION: An electronic device 1 has electronic parts 10 and 20 facing each other, a connection portion 30 which is provided between the electronic parts 10 and 20 to electrically connect the electronic parts 10 and 20, and plural projecting portions 12 which are juxtaposed at an outer edge of the electronic part 10 at the outside of the connection portion 30 to be in contact with the opposite electronic part 20. Resin 40 is provided between the electronic parts 10 and 20. The plural projecting portions 12 suppress the protrusion of the resin 40 provided between the electronic parts 10 and 20 to the outside from the edge portion 50 of the opposite area between the electronic parts 10 and 20.</p>
申请公布号 JP2015185567(A) 申请公布日期 2015.10.22
申请号 JP20140058163 申请日期 2014.03.20
申请人 FUJITSU LTD 发明人 IMAIZUMI NOBUHIRO
分类号 H01L25/065;H01L21/56;H01L21/60;H01L23/28;H01L25/07;H01L25/18 主分类号 H01L25/065
代理机构 代理人
主权项
地址