| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC tag label capable of utilizing easiness of rupture of a lamination structure itself of the IC tag label, and capable of avoiding application of easiness of rupture with visibility, and complicated processing such as a perforation and cut to an inlet base material.SOLUTION: An IC chip 4 is connected to an antenna circuit 5 installed on one surface of an inlet base material 6 via a conductive adhesive agent. One surface or both surfaces of the inlet base material 3 are coated with adhesive layers 2a, 2b. Out of the adhesive layers 2a, 2b, the adhesive layer 2b coating the antenna circuit 5 and IC chip 4 is an adhesive material itself and has no support base material.</p> |
