SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

According to one embodiment of the present invention, a semiconductor device has a second semiconductor chip mounted on a first rear surface of a first semiconductor chip. The first rear surface of the first semiconductor chip includes: a first region having formed therein a plurality of first rear surface electrodes that are electrically connected to the second semiconductor chip via protruding electrodes; and a second region, which is formed further toward the peripheral end portion side than the first region, and which has a first metal pattern formed therein. The protruding height of the first metal pattern with respect to the first rear surface is less than the protruding heights of the first rear surface electrodes with respect to the first rear surface.