发明名称 MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus of an electronic device capable of simplifying a manufacturing process.SOLUTION: A pillar 89 is formed by discharging a conductive material onto a wiring 83. A liquid repellent agent 95 is discharged at an upper end 89A of the pillar 89. An insulation layer is formed at a circumference of the pillar 89. To form the insulation layer, a UV curable resin discharged from a nozzle 55 is prevented from being wet and spread up to an upper end face of the pillar 89 by coating in advance the liquid repellent agent 95 at an upper end 89A of the pillar 89.</p>
申请公布号 JP2015185738(A) 申请公布日期 2015.10.22
申请号 JP20140061781 申请日期 2014.03.25
申请人 FUJI MACH MFG CO LTD 发明人 TSUKADA KENJI;SUZUKI MASATO;KAWAJIRI AKIHIRO;HASHIMOTO YOSHITAKA;FUJITA MASATOSHI
分类号 H05K3/10;B29C67/00;H05K1/11;H05K3/40 主分类号 H05K3/10
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