| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction structure capable of achieving enhancement of heat resistance at a junction of metal layers having different coefficients of thermal expansion.SOLUTION: A junction structure (M) is obtained by bonding a first metal layer (11) and a second metal layer (21) having a coefficient of thermal expansion different from that of the first metal layer. More specifically, the inventive junction structure includes a first metal layer receiving heat from a heating element (10), and a second metal layer bonded to the first metal layer and receiving heat therefrom. The first metal layer and second metal layer are subjected to the solid-phase bonding, via a junction interface organization having a thickness of 50 nm or less. Since the first metal layer and second metal layer are bonded not via a brazing material or an adhesive, the inventive junction structure exhibits high heat transfer and heat resistance. Such a junction structure is suitable for a power module. |
