发明名称 Guide Vane and Jetting Apparatus
摘要 A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate 11 having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid; and a half-cylindrical plate 12 having a prescribed inner surface shape and a prescribed height, being stood on the board 13 on which the first member 11 is stood and changing the flow direction of the fluid as shown in FIG. 1. The half-cylindrical plate 11 and the half-cylindrical plate 12 are faced so that an inner surface of the half-cylindrical plate 11 is faced to an edge of the half-cylindrical plate 12 and an inner surface of the half-cylindrical plate 12 is faced to an edge of the half-cylindrical plate 11. This structure allows to jet the molten solder to a target place and uniformize a widthwise distribution of the jetting height of the molten solder.
申请公布号 US2015305216(A1) 申请公布日期 2015.10.22
申请号 US201314397483 申请日期 2013.03.19
申请人 Senju Metal Industry Co., Ltd. 发明人 Nishida Shingo
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项 1: A guide vane, comprising a plurality of pair structures; each of said pair structures including a first member having a curvature or angular inner surface shape and having a first prescribed height and a second member having a curvature or angular inner surface shape and having a second prescribed height; wherein said first and second members of said pair structure that are arranged under a condition that said first and second members are shifted left or right in a view from a main flow direction of a fluid, said pair structures are located on a board in the main flow direction of the fluid, the flow of the fluid is directed into an opening defined by edges of said first and second members; and the fluid is turned in said pair structure to change the flow direction from a horizontal direction to a vertical direction.
地址 Tokyo JP