| 发明名称 |
PRINTED CIRCUIT BOARD |
| 摘要 |
A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area. |
| 申请公布号 |
US2015305149(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201514688881 |
申请日期 |
2015.04.16 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Kondo Takuya;Matsumoto Shoji;Hayashi Seiji |
| 分类号 |
H05K1/03;H01B3/40;H05K1/02;H01L23/498;H05K1/18 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a printed wiring board; a semiconductor device mounted on the printed wiring board; a plurality of connection terminals which connect the printed wiring board and the semiconductor device and are disposed at intervals; and an underfill material which is filled between the printed wiring board and the semiconductor device to cover the plurality of connection terminals, wherein the underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. |
| 地址 |
Tokyo JP |
