THREE-DIMENSIONAL SEMICONDUCTOR DEVICES INCLUDING A CONNECTION REGION

摘要

Semiconductor devices and methods of forming the semiconductor devices are provided. The semiconductor devices may include a peripheral circuit part that is disposed under a cell array circuit part. The peripheral circuit part may drive the cell array circuit part. The semiconductor devices may also include first conductive lines, which are connected to the peripheral circuit part, and second conductive lines, which are connected to the cell array circuit part. The first conductive lines and the second conductive lines may have substantially the same shape, and the first conductive lines may overlap with the second conductive lines in a connection region, respectively.

主权项

1. A semiconductor device comprising:
a substrate comprising a circuit region and a first connection region disposed at a side of the circuit region; a peripheral circuit part disposed on the substrate in the circuit region; first conductive lines electrically connected to the peripheral circuit part and extending into the first connection region; a cell array circuit part disposed on the peripheral circuit part; second conductive lines electrically connected to the cell array circuit part and disposed above the first conductive lines; and first conductive contacts connecting the second conductive lines to the first conductive lines, respectively, wherein the first conductive lines and the second conductive lines have substantially equal shapes, and the first conductive lines overlap with the second conductive lines in the first connection region, respectively, when viewed from a plan view.