MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE

摘要

An assembly method that includes providing a first semiconductor device and positioning a second semiconductor device at least partially over the first semiconductor device is disclosed. Spacers space the active surface of the first semiconductor device substantially a predetermined distance apart from the back side of the second semiconductor device. Discrete conductive elements are extended between the active surface of the first semiconductor device and the substrate prior to positioning of the second semiconductor device. Intermediate portions of the discrete conductive elements pass through an aperture formed between the active surface of the first semiconductor device, the back side of the second semiconductor device, and two of the spacers positioned therebetween. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

主权项

1. A multi-chip module on a substrate having contact areas on a surface thereof, comprising:
a first semiconductor device having an active surface including bond pads thereon and an opposing back side affixed to the substrate; a second semiconductor device having a back side; spacers interposed between the active surface of the first semiconductor device and the back side of the second semiconductor device; discrete conductive elements, each extending over the active surface of the first semiconductor device from respective bond pads of the bond pads to respective contact areas on the substrate surface between two of the spacers; a dielectric coating on at least portions of at least one of the discrete conductive elements and the back side of the second semiconductor device, the dielectric coating configured to electrically isolate the discrete conductive elements from the back side of the second semiconductor device; and an insulative material disposed at least partially between the first semiconductor device and the second semiconductor device.