RESIST FILM FORMING DEVICE AND METHOD, CONDUCTIVE FILM FORMING AND CIRCUIT FORMING DEVICE AND METHOD, ELECTROMAGNETIC WAVE SHIELD FORMING DEVICE AND METHOD, SHORTWAVE HIGH-TRANSMISSIBILITY INSULATION FILM FORMING DEVICE AND METHOD, FLUORESCENT LIGHT BODY FILM FORMING DEVICE AND METHOD, TRACE MATERIAL COMBINING DEVICE AND METHOD, RESIN MOLDING DEVICE, RESIN MOLDING METHOD, THIN FILM FORMING DEVICE, ORGANIC ELECTROLUMINESCENCE ELEMENT, BUMP FORMING DEVICE AND METHOD, WIRING FORMING DEVICE AND METHOD, AND WIRING STRUCTURE BODY

摘要

Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.