FLAT NO-LEAD PACKAGE AND THE MANUFACTURING METHOD THEREOF

摘要

A flat no-lead package includes an encapsulating material, and a die pad, a chip, a plurality of first contact pads and a plurality of second contact pads disposed in the encapsulating material. The encapsulating material has a package bottom surface. The die pad has a plurality of die pad extensions extending from the edges thereof. The chip is mounted on the die pad. The first contact pads are disposed near the edges of the encapsulating material and electrically coupled to the chip. The second contact pads are located between the die pad and the first contact pads and electrically coupled to the chip. Each of the second contact pads have a second contact pad extension corresponding to one of the die pad extensions respectively. The bottom surfaces of the first contact pads, the second contact pads and the second contact pad extensions arc exposed on the package bottom surface,

主权项

1. A flat no-lead package comprising:
an encapsulating material, having a package bottom surface; a die pad, disposed in the encapsulating material and adjacent to the package bottom surface, wherein a plurality of die pad extensions extend from edges of the die pad, and a bottom surface of one end of each of the die pad extensions which is away from the die pad is exposed on the package bottom surface; a chip, disposed in the encapsulating material and mounted on the die pad; a plurality of first contact pads, disposed in the encapsulating material and near edges of the encapsulating material and being electrically coupled to the chip, wherein a bottom surface of the first contact pads is exposed on the package bottom surface; and a plurality of second contact pads, disposed in the encapsulating material and located between the die pad and the first contact pads and being electrically coupled to the chip, wherein each of the second contact pads has a second contact pad extension corresponding to one of the die pad extensions respectively, bottom surfaces of the second contact pads and the second contact pad extensions are exposed on the package bottom surface.