| 发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
A method for fabricating semiconductor package structure is disclosed. The method includes: providing a wafer having a front side and a backside; forming a plurality of through-silicon vias (TSVs) in the wafer and a plurality of metal interconnections on the TSVs, in which the metal interconnections are exposed from the front side of the wafer; performing a monitoring step to screen for TSV failures from the backside of the wafer; and bonding the wafer to a substrate. |
| 申请公布号 |
US2015303120(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414256989 |
申请日期 |
2014.04.20 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Zhang Jubao;Zhang Xing Hua;Liao Hong |
| 分类号 |
H01L21/66;H01L23/522;H01L21/78;H01L23/00 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating semiconductor package structure, comprising:
providing a wafer having a front side and a backside; forming a plurality of through-silicon vias (TSVs) in the wafer and a plurality of metal interconnections on the TSVs, wherein the metal interconnections are exposed from the front side of the wafer; performing a monitoring step to screen for TSV failures from the backside of the wafer; and bonding the wafer to a substrate. |
| 地址 |
Hsin-Chu City TW |
