| 发明名称 |
SYSTEM AND METHODS OF REMOVING A MULTI-LAYER COATING FROM A SUBSTRATE |
| 摘要 |
A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate. |
| 申请公布号 |
US2015298288(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414254052 |
申请日期 |
2014.04.16 |
| 申请人 |
General Electric Company |
发明人 |
Fulton Blake Allen;DePalma Michael Anthony;Sarratt Craig Lowell;Cardillo Ryan Jeffrey |
| 分类号 |
B24B49/02;F01D5/00;B24B49/16;B23P6/00;B24B19/14;B24B49/00 |
主分类号 |
B24B49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system for use in removing a multi-layer coating from a substrate, the multi-layer coating including at least one layer of a first coating applied to the substrate and at least one layer of a second coating applied over the first coating, the first coating formed from a first material and the second coating formed from a second material different from the first material, said system comprising:
a grinding mechanism configured to remove the multi-layer coating from the substrate; and a controller coupled in communication with said grinding mechanism, said controller configured to:
position said grinding mechanism against the multi-layer coating;initiate a first removal mode that directs said grinding mechanism to traverse across the substrate;monitor a variable operating parameter of said grinding mechanism during the first removal mode; andevaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate. |
| 地址 |
Schenectady NY US |
