| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device and a manufacturing method of the same, which ensure fixed log-term stability while suppressing increase in physical size and deterioration in heat radiation performance.SOLUTION: A semiconductor device includes: an electronic component (20, 20a, 20b); a mold resin part (30); a heat sink (40, 40a, 40b) for radiating generated heat of the electronic component; and a collar (50, 50a, 50b) inserted in the mold resin part. The heat sink is connected to an interior space (53, 53a, 53b) of the collar and has a through hole (48, 48a, 48b) into which an external screw is inserted. A heat radiation surface (41, 41a, 41b) of the heat sink is exposed from one surface of the mold resin part. The collar is formed by using a material having rigidity higher than that of the mold resin part and one (51, 51a, 51b) of an opening end is attached firmly to the heat sink and the other (52, 52a, 52b) is exposed from a rear face opposite to the one surface of the mold resin part. |
