METHOD FOR MANUFACTURING OPTICAL PATH CONVERSION COMPONENT AND OPTICAL PATH CONVERSION COMPONENT

摘要

PROBLEM TO BE SOLVED: To obtain an optical path conversion component having a deep reflection plane while using a silicon substrate having a (100) plane as a wafer surface that is widely employed for a silicon substrate, and to manufacture a semiconductor optical path conversion component that is smooth and has little undercut.SOLUTION: An optical path conversion component is manufactured through the following steps. They are: a step of forming a pattern of an etching mask on a silicon substrate having a (100) plane as a wafer surface in such a manner that a reflection plane is made parallel to a <100> axis; and an etching step of immersing the silicon substrate in a quaternary ammonium hydroxide aqueous solution with addition of at least one of a surfactant, polyethylene glycol, and alcohol, and controlling a temperature of the aqueous solution to a temperature range of 65°C or higher and 75°C or lower through an etching period to carry out anisotropic etching so as to form a (110) reflection plane inclined at 45° with respect to the wafer surface.