发明名称 |
PRINTED-CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed-circuit board capable of improving radiation performance and forming a fine circuit on a substrate surface layer.SOLUTION: A printed-circuit board comprises: a core substrate 2 in which a wiring pattern 4 is formed on at least one surface of an insulating plate 1; an insulating resin layer 21a laminated on a surface of the core substrate 2; a housing unit 11 which is a through-hole penetrating the core substrate 2 and the insulating resin layer 21a; and a metal small piece 40 housed in the housing unit 11. The metal small piece 40 is fixed by filling a metal small piece fixing resin 13 with insulation quality in the gap between an inner peripheral surface of the housing unit 11 and the metal small piece 40.</p> |
申请公布号 |
JP2015185671(A) |
申请公布日期 |
2015.10.22 |
申请号 |
JP20140060520 |
申请日期 |
2014.03.24 |
申请人 |
KYOCERA CIRCUIT SOLUTIONS INC |
发明人 |
KAWAGOE ATSUO |
分类号 |
H01L23/12;H01L21/60;H01L23/36;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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