METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board which has less common difference between a top and a bottom of a circuit pattern even when a metal circuit board is thick and in which the metal circuit board having the circuit pattern with an intended dimensional precision is bonded with a ceramic board; and provide a manufacturing method of the metal-ceramic circuit board.SOLUTION: A manufacturing method of a metal-ceramic circuit board comprises the steps of: bonding a circuit metal plate 12 which is formed to have a shape similar to a circuit pattern and have a thickness at a part other than a part substantially corresponding to the circuit pattern to be thinner than a thickness at the part substantially corresponding to the circuit pattern to a ceramic board 10; coating almost a whole area of the circuit metal plate 12 with a resist; subsequently removing at least a part of the resist coated on a surface of the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12; and removing the part other than the part substantially corresponding to the circuit pattern of the circuit metal plate 12 by etching.