ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, AND CONNECTED BODY

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition, in spite of being a radical curing type adhesive, maintaining sufficient adhesive strength and connection reliability even under the connection conditions at a low temperature (e.g., lower than 140°C) also in a short time (e.g., 5 seconds or less) and further capable of suppressing peeling with an adherend under high temperature-high humidity conditions.SOLUTION: Provided is an adhesive composition containing: (a) a thermoplastic resin; (b) a radical polymerizable compound; (c) a radical polymerization initiator; and (d) an epoxy resin having no (meth)acryloyloxy groups, and not substantially containing the cation polymerization curing agent of an epoxy resin.