SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

摘要

A semiconductor package includes the following elements. A high-output switch IC includes an IC top surface on which an electrode is disposed and an IC bottom surface on which no electrode is disposed. A connecting terminal is formed at a position outside a projection region toward a side portion of the semiconductor package. The projection region is a region projected in a thickness direction of the high-output switch IC. A wire electrically connects the electrode and the connecting terminal. A mold resin section covers the IC top surface and the wire and also covers a surface of the connecting terminal to which the wire is connected. A surface of the connecting terminal opposite to the surface to which the wire is connected is not covered with the mold resin section but is exposed. The IC bottom surface is not covered with a metal.

主权项

1. A semiconductor package comprising:
a high-output switch integrated circuit including an integrated circuit top surface having an electrode disposed and an integrated circuit bottom surface having no electrode disposed; a connecting terminal formed at a position outside a projection region toward a side portion of the semiconductor package, the projection region being a region projected in a thickness direction of the high-output switch integrated circuit; a wire electrically connecting the electrode to the connecting terminal; and a mold resin section covering the integrated circuit top surface and the wire and also covering a surface of the connecting terminal to which the wire is connected, wherein a surface of the connecting terminal opposite to the surface to which the wire is connected is not covered with the mold resin section but is exposed, and the integrated circuit bottom surface is not covered with a metal.