| 发明名称 |
ELECTRONIC DEVICE AND HEAT DISSIPATION PLATE |
| 摘要 |
An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing. |
| 申请公布号 |
US2015300750(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
US201414257002 |
申请日期 |
2014.04.21 |
| 申请人 |
HTC Corporation |
发明人 |
Tan Tzu-Chia;Sun Chin-Kai;Lai Jen-Cheng;Chang Chih-Lin |
| 分类号 |
F28D15/02;G06F1/20;F28D15/04 |
主分类号 |
F28D15/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a frame or a housing; at least one heat generating unit; and a heat pipe, disposed on the frame or the housing, wherein an orthogonal projection of the heat pipe on the frame or on the housing is at least partially overlapped with an orthogonal projection of the heat generating unit on the frame or on the housing. |
| 地址 |
Taoyuan County TW |
