| 发明名称 |
THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS |
| 摘要 |
Example embodiments of the present disclosure generally relate to thermal interface material assemblies. In an example embodiment, a thermal interface material assembly generally includes a substrate and one or more pillars along a first and/or second side portion of the substrate. |
| 申请公布号 |
WO2015160528(A1) |
申请公布日期 |
2015.10.22 |
| 申请号 |
WO2015US24055 |
申请日期 |
2015.04.02 |
| 申请人 |
LAIRD TECHNOLOGIES, INC. |
发明人 |
STRADER, JASON L.;HILL, RICHARD F. |
| 分类号 |
H01L23/34;H05K7/20 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
