| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering film deposition apparatus capable of applying a magnetic field onto a substrate and removing the magnetic field, and reducing a magnetic field except on the substrate in magnetic field removal.SOLUTION: A sputtering film deposition apparatus includes: a vacuum container 1; a substrate holder 9; target holders 5a, 5b which hold targets 4a, 4b; a first ring-shaped magnetic circuit and a second ring-shaped magnetic circuit 3 which apply magnetic fields onto a substrate 10 on the substrate holder respectively; and rotation means 8a, 8b, and 9 which rotate the first ring-shaped magnetic circuit and second ring-shaped magnetic circuit relatively. The first ring-shaped magnetic circuit has rod-like magnets M1, M2 which are arranged substantially in parallel and yokes Y1, Y2 which connect the rod-like magnets M1, M2, and the second ring-shaped magnetic circuit has rod-like magnets M3, M4 which are arranged substantially in parallel and yokes Y3, Y4 which connect the rod-like magnets M3, M4. |
