发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To suppress occurrence of burrs at a substrate type terminal.SOLUTION: A method includes: a step of preparing a mother substrate 200a having a first principal surface 210a and a second principal surface which are positioned on the sides opposite to each other and each have a wiring pattern formed thereon; and a step of cutting the mother substrate 200a along a cut line CL1 which is a virtual line to be individual substrate type terminal. In the step of singulating the mother substrate 200a to the substrate type terminals, the mother substrate 200a is cut toward the second principal surface side from the first principal surface side on the cutline CL1 which intersects with the wiring pattern of the first principal surface 210a and not intersect with the wiring pattern of the second principal surface.</p>
申请公布号 JP2015185650(A) 申请公布日期 2015.10.22
申请号 JP20140059983 申请日期 2014.03.24
申请人 MURATA MFG CO LTD 发明人 HATTORI KAZUO;FUJIMOTO TSUTOMU
分类号 H05K1/02;H01G2/06;H05K3/00 主分类号 H05K1/02
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