| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polyimide laminate structure which can suppress warpage and easily and simply separate a resin substrate and to provide a method for producing the same.SOLUTION: There is provided a polyimide laminate structure which comprises a support having a thermal expansion coefficient of 1 to 10 ppm/K, a first polyimide layer having a thermal expansion coefficient smaller than that of the support and a second polyimide layer having a thermal expansion coefficient larger than that of the support, wherein the first polyimide layer and the second polyimide layer are laminated in order on the support and the support can be separated at the interface between the first polyimide layer and the second polyimide layer. In addition, there is provided a method for producing a polyimide laminate structure by applying and drying a resin solution of a polyimide and a polyimide precursor and subjecting to heat treatment to form the above individual polyimide layers.</p> |
